OLED/LCD REWORK EQUIPMENT

In the smartphone and digital watch industries, there are repair and after service problems which may cause many difficulties such as service costs and logistics costs. It was difficult to separate OLED and LCD from the device and rework or repair it. In response, BSP provides solutions to solve these difficulties with its own patented technologies and equipment.

LCT EQUIPMENT

BSP 3D 360-degree Rotational Laser Processing Equipment provides Cutting-edge technology for unparalleled performance.

5W UV Laser with advanced capabilities:
ØPower: 5W
ØPrecision: X, Y axis 360º tumbler JIG for seamless manipulation
ØMarking Area: 110 x 110mm

MDM® EQUIPMENT

• MDM® (DIRECT MOUNTING TECHNOLOGY) is an innovative and optional soldering method designed for selective soldering applications.
• This technique aims to minimize thermal damage to the subject by employing a room temperature non-contact soldering approach.
• MDM® stands out as a solution that allows for precise soldering without subjecting the material to excessive heat, ensuring the integrity of the components involved.

GLASS

• MDM® (DIRECT MOUNTING TECHNOLOGY) is an innovative and optional soldering method designed for selective soldering applications.

• This technique aims to minimize thermal damage to the subject by employing a room temperature non-contact soldering approach.

• MDM® stands out as a solution that allows for precise soldering without subjecting the material to excessive heat, ensuring the integrity of the components involved.

2D/ 3D LASER TRIMMING EQUIPMENT

• Experience precision in three-dimensional shaping with BSP 2D/ 3D Laser Trimming Equipment.
• Our laser trimming technology ensures accurate and efficient processing of objects in three-dimensional space. Elevate your manufacturing and shaping processes with the precision of BSP 3D Trimming.